The semiconductor industry stands at a fascinating juncture. For decades, its trajectory was famously charted by Intel co-founder Gordon Moore's 1965 prediction that the number of transistors on an integrated circuit (IC) would double approximately every two years. Moore's Law guided the industry to deliver ever smaller, faster, and cheaper chips, transforming our infrastructure, our homes, and even the mobile devices in our hands.
However, as the industry continues its quest to shrink transistors beyond the sub one nanometer (nm) range, it faces unprecedented challenges. Hurdles such as skyrocketing manufacturing costs are reshaping the roadmap for chipmakers, leading to deviations from Moore’s Law.
One of the most transformative developments in recent semiconductor history has been the advancement of ASML’s Extreme ultraviolet (EUV) lithography technology. By using light with a wavelength of 13.5nm, EUV machines have significantly advanced the field by enabling precise patterning of features at sub-7nm scales.
Looking forward, the semiconductor industry is addressing challenges in miniaturisation by adopting new technologies and strategies. These approaches involve examining different architectures and creating new testing methods to enhance yields (increase the number of functional chips produced from each wafer), addressing limitations imposed by physics and economics.